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Very little work has been published on teaching for social justice in the Middle East. This paper demonstrates how a group of Arab women’s reading and writing of their world was facilitated by using a social justice pedagogy based on Gutstein’s (2006) model. The study involved 20 Middle Eastern women (ages ranging from 16-36). The findings suggest that the students have developed significant abilities to use mathematics as a tool to read and write their world. In addition, the findings show that, like their counterparts elsewhere in the world, these young women are also interested in social justice issues. This is particularly significant because of current ongoing social developments in the Middle East.

The goal of this study was to examine individual, relational, and organizational determinants of negotiation behavior (problem solving, contending, yielding, and avoiding) between planning and marketing departments in manufacturing organizations. Results from a study among 41 managers and 85 planning and marketing employees within 11 firms showed that individual personality, perceived interdepartmental interdependence, and organizational strategy were each related to the negotiation behavior of department members. Desirable negotiation behavior—specifically, the problem‐solving approach—was more likely when individuals were extraverted and agreeable, when employees perceived high interdepartmental interdependence, and when organizations did not have a low‐cost strategy. Contending was more likely when individuals were extraverted and disagreeable, and yielding was more likely when department members perceived a power advantage vis‐à‐vis the other department. All four styles of negotiation behavior were more likely the less the organizations had a low‐cost strategy. These findings provide guidance to organizations in their efforts to encourage constructive negotiation behavior between departments.

A review of state‐of‐the‐art technology pertinent to tape automated bonding (for fine pitch, high I/O, high performance, high yield, high volume and high reliability) is presented. Emphasis is placed on a new understanding of the key elements (for example, tapes, bumps, inner lead bonding, testing and burn‐in on tape‐with‐chip, encapsulation, outer lead bonding, thermal management, reliability and rework) of this rapidly moving technology.

This article provides a critical review of four constructs-organizational identification, organizational commitment, occupational identification, and occupational commitment-to advance our understanding about how public sector employees from different occupations may become psychologically attached to their organizations. This review is intended to clarify previous inconsistencies as well as spark new interest among public administration researchers to examine sources and consequences of public employees’ organizational identification and commitment. This article also elucidates about how public sector employees’ attachment to their occupations may influence their attachment to their organizations. In that effort, this article reviews interrelationships among the four constructs. Finally, based on the patterns of connections observed, a future research program including seven testable research propositions is proposed.

This paper describes the major new I/C packaging technologies now coming into use, i.e., chip carriers and tape automated bonding. It deals with the reasons for their development, where they are most likely to be used and their impact on current interconnection technologies, i.e., PCBs and thick film hybrids. The paper also looks briefly at some new developments in ‘off‐the‐chip’ interconnection, e.g., laminates and materials.

This paper looks at the growth, current situation and future of the thick film hybrid industry worldwide. The approach taken has been to regard the thick film hybrid as primarily a sub‐assembly, both from a commercial and technical point of view. This helps to identify those major features that have shaped the industry and will influence its future.

At the Extraordinary General Meeting of the Institute of Circuit Technology held on Tuesday, 20th November 1979, a resolution was passed which allowed companies trading in the circuit technology industry to become affiliated to the Institute. To mark that historical decision the Council decided to organise a trade exhibition to be held concurrently with the Annual Symposium, Brunel 80.

This paper looks at the development of thick film hybrids and their relative position in the markets of the USA, Japan and Western Europe. Industry structure and the importance of in‐house manufacturing and development are discussed, together with future technical trends. Hybrids are viewed as one of a growing number of interconnection technologies available to the OEM, and no easing of substitution pressures is forecast. However, opportunities will continue to exist for this important technology, providing suppliers position themselves carefully in the market.

This conspectus attempts to achieve three objectives: